陶氏DOW有机硅树脂DOWSIL™ HC 2000

One-part, translucent, moisture RTV cure, fast tack-free, controlled volatility, very low viscosity.

陶氏DOWDOWSIL™HC 2000参数

颜色：半透明

1MHz时的介电常数：2.7

介电强度：850伏特/ milv / mil

可流动：√

室温固化 - 小时：1.5小时

自流平：√

温度范围：-45至200摄氏度

粘度：150 mPa.s

体积电阻率：1e + 017 ohm-centimeters

对铝的附着力：√

对陶瓷的附着力：√

对金属的附着力：√

对塑料的附着力：√

烷氧基固化：√

陶瓷：√

可固化涂料：√

高温稳定性：√

低温稳定：√

单部分：√

塑料：√

无溶剂：√

热阻：√

热固性： √

Color:Translucent

Dielectric Constant at 1MHz:2.7

Dielectric Strength:850 volts per milv/mil

Flowable:√

Room Temperature Cure - Hours:1.5 Hours

Self Leveling:√

Temperature Range:-45 to 200 Deg C

Viscosity:150 mPa.s

Volume Resistivity:1e+017 ohm-centimeters

Adhesion to Aluminum:√

Adhesion to Ceramic:√

Adhesion to Metal:√

Adhesion to Plastic:√

Alkoxy Cure:√

Ceramics:√

Curable Coating:√

High Temperature Stable:√

Low Temperature Stable:√

One-Part:√

Plastics:√

Solventless:√

Thermal Resistance:√

Thermosetting:√