陶氏DOW有机硅树脂DOWSIL™ 3-4150 Dielectric Gel Kit

Two-part, transparent green, fast RT or heat cure.

陶氏DOWDOWSIL™3-4150介电凝胶套件参数

介电强度：375伏特/ milv / mil

耗散因子在100Hz：0.002

耗散因子在100kHz：0.0001

凝胶硬度：115克/渗透（1

室温固化 - 小时：0.75至1.5小时

比重@ 25C：0.97

加成固化：√

高温稳定：√

低温稳定：√

软凝胶：√

软应力消除：√

热阻：√

两部分：√

Dielectric Strength:375 volts per milv/mil

Dissipation Factor at 100 Hz:0.002

Dissipation Factor at 100 kHz:0.0001

Gel Hardness:115 Grams/Penetration (1

Room Temperature Cure - Hours:0.75 to 1.5 Hours

Specific Gravity @ 25C:0.97

Addition Cure:√

High Temperature Stable:√

Low Temperature Stable:√

Soft Gel:√

Soft Stress Relieving:√

Thermal Resistance:√

Two-Part:√