陶氏DOW有机硅胶粘剂DOWSIL™ EG-4100 Kit

高温稳定性凝胶，适用于连续模式下-40℃至+ 200℃的操作温度，＆gt;在215℃下3000小时。坚韧的凝胶，可在热循环下提高抗分层性。

DOWSIL™EG-4100介电凝胶，一种双组分，低温韧性凝胶，在-40°C至215°C的温度范围内具有稳定性;其卓越的稳定性可实现高性能，减少现场故障和保修成本。

越来越多的行业趋势要求具有更高功率密度的小部件;这些趋势需要依赖更强的凝胶来保护组件及其性能。 DOWSIL™EG-4100具有类似于液体的自我修复品质，同时保持稳定性。这些特性使产品得以保护表面污染物水分的脆弱成分，包括高压电绝缘。

EG-4XXX系列提供：

保护受热和机械应力影响的互连

在恶劣环境条件下的稳定性

无表面在较大温度范围内从外壳开裂或分层

DOWSIL™EG-4100介电凝胶适用于：

用于功率会聚的IGBT模块的灌封

在高温下操作的PCB和敏感设备的保护

工业传感器和执行器以及高压设备的绝缘

High temperature stability gel, suitable for operating temperature ranging from -40C to + 200℃ in continuous mode and > 3,000 hours at 215℃. Tough gel for increased resistance to delamination under thermal cycling.

DOWSIL™ EG-4100 Dielectric Gel, a two part, low termperature tough gel, exhibits stability within temperatures ranging from -40° C to 215° C; its superb stability allows for high performance reducing field failures and warranty costs.

Increasingly, industry trends demand small components with higher power densities; these trends require a reliance on stronger gels that protect assemblies and their properties. DOWSIL™ EG-4100 displays self-healing qualities similar to a liquid whilst maintaining stability. These properties allow the product to protect fragile components from surface contaminants moisture, including electrical insulation for high voltages.

The EG-4XXX series provides:

• Protection for interconnections subject to thermal and mechanical stresses
• Stability under harsh environmental conditions
• No surface cracking or delamination from housing within a large temperature range

DOWSIL™ EG-4100 Dielectric Gel is suitable for:

• The potting of IGBT modules for power converions
• Protection of PCB and sensitive devices operated at high termperatures
• Industrial sensors and actuators and insulation of high voltage devices

陶氏DOWDOWSIL™EG-4100套件参数