陶氏DOW有机硅密封胶DOWSIL™ SE 9100

单组分有机硅配方，可在室温下实现快速无粘性加工，具有出色的流动性和对水和污染物的密封性。

室温固化
室温下快速无粘性固化

优异的流动性
分配后良好的流动性，填充性或自流平性

可靠的性能
保持良好的防水和防污染性

] DOWSIL™SE 9100黑色粘合剂是一种单组分有机硅配方，可在室温下实现快速无粘性加工，提供快速在线处理，同时允许PCB系统组​​件的可再加工性。[123

它通常在室温和环境下固化相对湿度为30％至80％，无需固化烤箱以及相关的能源和资金成本。由于粘合剂和组分可以在约10至120分钟的短得多的时间内处理，这取决于所选择的粘合剂和所施加的量，因此可以实现更快的制造产量。

大于90％的完整物理性质应该可在24至72小时内完成，并根据产品而有所不同。低于60°C（140°F）的温和热可用于通过加速固化来增加产量。

DOWSIL™SE 9100粘合剂在广泛的操作条件下保持其原有的物理和电气性能增强了移动，显示模块和其他设备的可靠性，使用寿命和成本效益sumer devices。

One-part silicone formulation that achieves fast tack-free processing at room temperature with excellent flowability and sealing against water and contaminants.

Room temperature curing
Fast tack-free curing at room temperature

Excellent flowability
Good flow, fill or self-leveling after dispensing

Reliable performance
Retains good sealing against water and contaminants

DOWSIL™ SE 9100 Black Adhesive is a one-part silicone formulation that achieves fast tack-free processing at room temperature, providing fast in-line processing while allowing reworkability for PCB system assemblies.

It is generally cured at room temperature and in an environment of 30 to 80 percent relative humidity, eliminating the need for curing ovens and the associated costs of energy and capital. Faster manufacturing throughput can be achieved since the adhesive and component can be handled in much shorter times of about 10 to 120 minutes, depending on the adhesive selected and the amount applied.

Greater than 90 percent of full physical properties should be attained within 24 to 72 hours and varies according to product. Mild heat below 60°C (140°F) may be used to increase through-put by accelerating the cure.

DOWSIL™ SE 9100 Adhesive retains its original physical and electrical properties over a broad range of operating conditions offering enhanced reliability, service life and cost-effective processing of mobile, display modules and other consumer devices.

陶氏DOWDOWSIL™SE 9100参数