陶氏DOW有机硅胶粘剂DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler

一种柔软且可压缩的材料，一旦固化，设计用于将安装在印刷电路板上的电子元件的热量散发到散热器，为发动机或变速器控制单元等模块提供可靠的冷却解决方案。

导热系数
1.5 W / mK

更容易加工
适合使用标准计量混合设备进行自动化应用

提高可靠性
随着时间的推移表现稳定

]更容易处理和长期性能稳定性

随着汽车PCB系统组​​件对汽车安全性，可靠性，性能和舒适性的贡献越来越大，它们也会产生更高的温度，从而降低功能随着时间的推移，模​​块的可靠性和可靠性。

陶氏消费者解决方案开发 - 并继续扩大 - 具有不同导热系数的硅树脂导热间隙填料组合，可大大提高可分配性，减少磨损（某些产品）在汽车引擎罩环境下，恶劣汽车中更可靠的应用具有稳定的性能。

陶氏消费品解决方案的导热间隙填料是柔软，可压缩，双组分硅胶，高导热率材料，专门配制，易于加工和有效散热来自关键汽车零部件，如发动机或变速箱

DOWSIL™TC-4515导热间隙填料提供1.5W / mK的导热系数 - 带来为您的制造或设计带来许多好处：

在恶劣温度下提高可靠性 - 有效地散发敏感元件的热量。在200°C时可承受峰值曝光，并可在高达150°C的工作温度下可靠地工作。

易于加工 - 这些先进的导热材料可轻松分配他们的原始包装，只需极少甚至不需要额外的工艺准备，使其非常适合使用标准计量混合设备进行自动化应用。

有效装配 - 避免垂直坍塌装配过程中的表面固化后，即使长时间使用，也能保持垂直稳定性。选择配方包含玻璃珠以控制粘合线组装过程中的厚度。

具有成本效益，快速固化 - 铂固化体系可以在室温下快速，可控地固化，但固化时间可以进一步加快加热以减少制造周期时间。不需要后固化步骤。

UL 94 V-0识别 - 获得Underwriters Laboratories UL 94标准认可，该标准评估用于设备中部件的塑料和硅树脂材料的可燃性和电器。根据UL 94认可是在最终产品上应用UL标签的一步。

如果您需要更高的导热性，请查看我们的 DOWSIL™TC-4525导热间隙填料[ 123]。

A soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.

Thermal Conductivity
1.5 W/m.K

Easier Processing
Suited for automated application using standard meter mix equipment

Increasing Reliability
Stable performance over time

Easier Processing and Long-Term Performance Stability

As automotive PCB system assemblies contribute ever greater value to automotive safety, reliability, performance and comfort, they are also generating higher temperatures that can reduce the functionality and reliability of modules over time.

Dow Consumer Solutions developed – and continues to broaden – a portfolio of silicone thermal conductive gap fillers with different levels of thermal conductivity that deliver greatly improved dispensability, reduced abrasiveness (certain products) and stable performance for more reliable applications in harsh automotive under the hood environments.

Thermally conductive gap fillers from Dow Consumer Solutions are soft, compressible, two-part silicone, high thermal conductivity materials specifically formulated to process easily and to effectively dissipate heat from critical automotive parts, such as engine or transmission

DOWSIL™ TC-4515 Thermally Conductive Gap Filler offers thermal conductivity of 1.5W/m.K – bringing a number of benefits to your manufacturing or design:

• Improved reliability in harsh temperatures – Effectively dissipate heat away from sensitive components. Withstand peak exposure at 200°C, and perform reliably at operating temperatures ranging up to 150°C.
• Easy processing – These advanced thermally conductive materials dispense easily from their original packaging with minimal to no additional process preparation, making them well-suited for automated application using standard meter mix equipment.
• Effective assembly – Avoid slumping on vertical surfaces during assembly. After cure, they maintain their vertical stability even after long use. Select formulations incorporate glass beads to control bond line thickness during assembly.
• Cost-effective, fast cure – The platinum cure system enables fast, controlled cure at room temperature, although cure times can be accelerated further with heat to reduce manufacturing cycle times. No post-cure steps are required.
• UL 94 V-0 recognition – Received recognition under Underwriters Laboratories UL 94 standard, which evaluates the flammability of plastic and silicone materials intended for parts in devices and appliances. Recognition under UL 94 is a step towards applying the UL label on your final product.

If you need a higher thermal conductivity, check out our DOWSIL™ TC-4525 Thermally Conductive Gap Filler.

陶氏DOWDOWSIL™TC-4525 CV导热间隙填料参数

颜色 - A部分：白色

1MHz时的介电常数：6.2

介电强度（kV / mm）：12 kV / mm

硬度计 - 肖氏00： 40肖氏00

以秒为单位的混合粘度：217

比重25℃：2.9

导热率：> 2.5瓦/米K

触变指数：4

粘度 - A部分：223 Pa.s

粘度 - B部分：216 Pa.s

[123 ]体积电阻率：2.6e + 014 ohm-centimeters

工作时间：40分钟

铂催化固化：√

两部分：√

Color - Part A:White

Dielectric Constant at 1MHz:6.2

Dielectric Strength (kV/mm):12 kV/mm

Durometer - Shore 00:40 Shore 00

Mixing Viscosity in Pas-sec:217

Specific Gravity @ 25C:2.9

Thermal Conductivity:> 2.5 Watts per meter K

Thixotropic Index:4

Viscosity - Part A:223 Pa.s

Viscosity - Part B:216 Pa.s

Volume Resistivity:2.6e+014 ohm-centimeters

Working Time:40 Minutes

Platinum-Catalyzed Cure:√

Two-Part:√