陶氏DOW有机硅胶粘剂DOWSIL™ EG-3810 Dielectric Gel

单组分，低温/高温凝胶

长效
在极端条件下持久，可靠的性能

[ 123] 保护 可靠保护免受破坏性环境条件

热稳定性 出色的热稳定性 - 来自 - 60°C至+ 200°C

DOWSIL™EG-3810凝胶作为电源转换应用的保护灌封材料，如绝缘栅双极晶体管（IGBT），具有持久的性能模块。其独特的热稳定性和低模量组合使其成为汽车PCB系统组​​件，传感器和执行器的理想解决方案，必须在大温度范围内可靠运行。

One-part, low/high temperature gel

Long Lasting
Long lasting, reliable performance in extreme conditions

Protection
Reliable protection against damaging environmental conditions

Thermal Stability
Excellent thermal stability -from -60°C to +200°C

DOWSIL™ EG-3810 Gel delivers long-lasting performance as a protective potting material for power conversion applications, such as insulated gate bipolar transistor (IGBT) modules. Its unique combination of thermal stability and low modulus also make it an appealing solution for automotive PCB system assemblies, sensors, and actuators that must operate reliably over large temperature ranges.

陶氏DOWDOWSIL™EG-3810介电凝胶参数

颜色：透明，无色

介电常数在100 kHz：2.9

介电常数在1MHz：2.9

介电强度（kV / mm）：21 kV / mm

热固化：30分钟@ 100摄氏度，10分钟@ 150摄氏度

粘度：690 mPa.s

单部分：√

Color:Clear, Colorless

Dielectric Constant at 100 kHz:2.9

Dielectric Constant at 1MHz:2.9

Dielectric Strength (kV/mm):21 kV/mm

Heat Cure:30 Minutes @ 100 Deg C,10 Minutes @ 150 Deg C

Viscosity:690 mPa.s

One-Part:√