陶氏DOW有机硅密封胶DOWSIL™ EE-3200 Low Stress Silicone Encapsulant

具有非常低的硬度和粘度，可最大限度地减少内部应力的产生，填补小间隙，并提高复杂和大批量电子设备的制造速度。

保护敏感成分
防止反复的热和机械应力，湿气和其他恶劣的环境因素。

经过验证的性能
用于数千个在恶劣气候条件下的微型逆变器。

提高系统价值
并降低系统密封剂提高可靠性的成本。

使用更可靠的密封剂降低系统成本，保护更长时间免受恶劣的气候条件

DOWSIL™EE-3200低应力硅胶密封剂结合了s具有密封剂导热性的凝胶缓解性能。

该材料在太阳能逆变器中得到成功验证，可为敏感元件提供一流的保护，防止重复的热应力和机械应力。作为水分和其他惩罚环境因素。使用有机硅密封剂有助于太阳能制造商实现更高的系统价值和更低的系统成本。

使这种材料在太阳能逆变器应用中如此成功的特性使其成为具有类似要求的其他应用的理想和经过验证的材料：[

低模量降低了元件的压力

导热系数有效地散热

良好的机械粘合避免了分层问题

快速固化和优化的工作时间允许更复杂的设计和更低的模块成本

介电强度和体积电阻率降低成本，因为不需要额外的介电屏障

易于使用 - 低粘度允许快速填充适合高通量制造工艺

最小的填料沉降使过程控制变得容易

符合认证要求

此外，DOWSIL EE-3200低应力硅胶密封剂解决了热诱导的压力问题。

Has a very low hardness and viscosity to minimize internal stress generation, fill small gaps, and improve manufacturing speed for complex and high volume electronic devices.

Protect Sensitive Components
Against repeated thermal and mechanical stress, moisture and other harsh environmental factors.

Proven Performance
Used in thousands of microinverters which are out there, in tough climatic conditions.

Improve System Value
And lower system cost with encapsulants that improve reliability.

Lower System Cost Using More Reliable Encapsulants that Protect Longer Against Tough Climatic Conditions

DOWSIL™ EE-3200 Low Stress Silicone Encapsulant combines the stress relieving properties of a gel with the thermal conductivity of an encapsulant.

This material is successfully proven in solar inverters, where it provides best-in-class protection of sensitive components against repeated thermal and mechanical stress, as well as moisture and other punishing environmental factors. Using silicone encapsulants help solar manufacturers to achieve higher system value and lower system costs.

The features that make this material so successful in solar inverter application, make it an ideal and proven material for other applications with similar requirements:

• Low modulus reduces pressure on components
• Thermal conductivity effectively dissipates heat
• Good mechanical adhesion avoids delamination issues
• Fast cure and optimized working time allows for more complex designs and lower module cost 
• Dielectric strength and volume resistivity reduce costs as no additional dielectric barrier is required
• Ease of use – low viscosity allows fast fill and fit with high throughput manufacturing processes
• Minimal filler settling allows for ease of process control
• Meets certification requirements

In addition, DOWSIL EE-3200 Low Stress Silicone Encapsulant solves the issue of thermally induced stress.

陶氏DOWDOWSIL™EE-3200低应力硅树脂密封剂参数

应用温度范围：-45至200摄氏度

颜色 - B部分：黑色

100 Hz时的介电常数：2.7

100 kHz时的介电常数： 2.7

1MHz时的介电常数：2.7

介电强度：350伏特/ milv / mil

介电强度（kV / mm）：14 kV / mm

[ 123]耗散因子在100 Hz：0.006

耗散因子在100 kHz：0.0008

伸长率：340％

线性CTE：360 um / m / Deg C

]

混合粘度：1700厘泊

拉伸强度：33 psi

导热系数：0.5瓦/米K

粘度（A部分）：1400 mPa.s

粘度（B部分）：2000 mPa.s

体积电阻率：1e + 015 ohm-centimeters

工作时间：30分钟

年轻＆＃ 39; s模数：12.7psi

Application Temperature Range:-45 to 200 Deg C

Color - Part B:Black

Dielectric Constant at 100 Hz:2.7

Dielectric Constant at 100 kHz:2.7

Dielectric Constant at 1MHz:2.7

Dielectric Strength:350 volts per milv/mil

Dielectric Strength (kV/mm):14 kV/mm

Dissipation Factor at 100 Hz:0.006

Dissipation Factor at 100 kHz:0.0008

Elongation:340 %

Linear CTE:360 um/m/Deg C

Mixing Viscosity:1700 Centipoise

Tensile Strength:33 psi

Thermal Conductivity:0.5 Watts per meter K

Viscosity (Part A):1400 mPa.s

Viscosity (Part B):2000 mPa.s

Volume Resistivity:1e+015 ohm-centimeters

Working Time:30 Minutes

Young's Modulus:12.7 psi