产品品牌美国陶氏
产品产地
产品型号DOWSIL™ TC-2035 Adhesive A/B Kit
包装规格
陶氏DOW有机硅胶粘剂DOWSIL™ TC-2035 Adhesive A/B Kit
双组分热固化有机硅高导热粘合剂,粘合线厚度低。Two-part heat cure silicone highly thermally conductive adhesive with low bond line thickness.
陶氏DOWDOWSIL™TC-2035粘合剂A / B套件参数
颜色 - A部分:白色
颜色 - B部分:红棕色
密度(g / cm3):3 g / cm3
介电常数100 Hz :6
100kHz下的介电常数:5.9
介电强度(kV / mm):21kV / mm
伸长率JIS#3:43%
[ 123]热固化:150℃下10分钟,125℃下30分钟JIS A型:95
线性CTE:18 um / m / Deg C
[ 123]适用期:> = 240分钟
拉伸强度JIS#3:3.6MPa
粘度:125000mPa.s
粘度(A部分):130000mPa .s
粘度(B部分):118000 mPa.s
体积电阻率:5.5e + 015 ohm-centimeters
加法固化:√
无底漆附着力:√
热阻:√
Color - Part A:White
Color - Part B:Reddish Brown
Density (g/cm3):3 g/cm3
Dielectric Constant at 100 Hz:6
Dielectric Constant at 100 kHz:5.9
Dielectric Strength (kV/mm):21 kV/mm
Elongation JIS#3:43 %
Heat Cure:10 Minutes @ 150 Deg C,30 Minutes @ 125 Deg C
JIS Type-A:95
Linear CTE:18 um/m/Deg C
Pot Life:>= 240 Minutes
Tensile Strength JIS#3:3.6 MPa
Viscosity:125000 mPa.s
Viscosity (Part A):130000 mPa.s
Viscosity (Part B):118000 mPa.s
Volume Resistivity:5.5e+015 ohm-centimeters
Addition Cure:√
rless Adhesion:√
Thermal Resistance:√