产品品牌美国陶氏
产品产地
产品型号DOWSIL™ 3-4237 Dielectric Firm Gel Kit
包装规格
陶氏DOW有机硅密封胶DOWSIL™ 3-4237 Dielectric Firm Gel Kit
适用于密封和保护(通过涂覆,封装或灌封)各种电子应用,包括汽车电子,特别是那些需要无底漆粘合的电子应用Suitable for sealing and protecting (by coating, encapsulating or potting) various electronic application including automotive electronics, especially those requiring primerless adhesion
陶氏DOWDOWSIL™3-4237电介质凝胶套件参数
颜色:半透明绿
介电常数在100 Hz:2.96
介电常数在100 kHz:2.96
介电强度:475伏特/ milv / mil
]耗散因数为100 Hz:0.002
耗散因数为100 kHz:9e-005
硬度计 - 肖氏00:25肖氏00
热固化:35分钟@ 100℃,12分钟@ 125℃,7分钟@ 150℃
粘度(A部分):300mPa.s
粘度(B部分):280mPa。 s
体积电阻率:9e + 014 ohm-centimeters
耐水性:√
加成固化:√
高温稳定:√
低温稳定性:√
无底漆附着力:√
热阻:√
热固性:√
两部分:√[123 ]
防水性:√Color:Translucent Green
Dielectric Constant at 100 Hz:2.96
Dielectric Constant at 100 kHz:2.96
Dielectric Strength:475 volts per milv/mil
Dissipation Factor at 100 Hz:0.002
Dissipation Factor at 100 kHz:9e-005
Durometer - Shore 00:25 Shore 00
Heat Cure:35 Minutes @ 100 Deg C,12 Minutes @ 125 Deg C,7 Minutes @ 150 Deg C
Viscosity (Part A):300 mPa.s
Viscosity (Part B):280 mPa.s
Volume Resistivity:9e+014 ohm-centimeters
Water Resistant:√
Addition Cure:√
High Temperature Stable:√
Low Temperature Stable:√
rless Adhesion:√
Thermal Resistance:√
Thermosetting:√
Two-Part:√
Water Resistance:√