陶氏DOW有机硅胶粘剂DOWSIL™ SE 4450 Thermally Conductive Adhesive

High Thermal Conductivity, Gray, Fast cure, Designed to provide efficient thermal transfer for the cooling of chip packaging as TIM 1 and ECU.

陶氏DOWDOWSIL™SE 4450导热胶参数

颜色：灰色

1MHz时的介电常数：0.006

介电强度：560伏特/ milv / mil

硬度计 - 肖氏A：95肖氏A

伸长率：46％

流动性：√

热固化：30分钟@ 150℃

自流平：√

剪切：500 psi

比重@ 25C：2.73

温度范围：-45至200摄氏度

抗拉强度：965 psi

导热系数：1.92瓦每米K

粘度：66000，mPa.s 66000 mPa.s

体积电阻率：3.3e + 015 ohm-centimeters

加成固化：√

单部分：√

耐臭氧性：√

无底漆附着力：√

无溶剂：√

热阻：√

抗紫外线：√

Color:Grey

Dielectric Constant at 1MHz:0.006

Dielectric Strength:560 volts per milv/mil

Durometer - Shore A:95 Shore A

Elongation:46 %

Flowable:√

Heat Cure:30 Minutes @ 150 Deg C

Self Leveling:√

Shear:500 psi

Specific Gravity @ 25C:2.73

Temperature Range:-45 to 200 Deg C

Tensile Strength:965 psi

Thermal Conductivity:1.92 Watts per meter K

Viscosity:66000,mPa.s 66000 mPa.s

Volume Resistivity:3.3e+015 ohm-centimeters

Addition Cure:√

Adhesion to Ceramic:√

Adhesion to Metal:√

Ceramics:√

High Temperature Stable:√

Low Temperature Stable:√

One-Part:√

Ozone Resistance:√

rless Adhesion:√

Solventless:√

Thermal Resistance:√

UV Resistance:√